DY-256C Thermal Imaging Module
DY-256C yog ib qho micro infrared thermal imaging module ntawm cov tiam tshiab, nrog ib tug me me heev vim nws high density integrated Circuit Court tsim.
Nws txais kev sib cais hom tsim, lub lens thiab lub rooj sib tham sib txuas yog txuas nrog lub tiaj tus cable, ntxiv rau wafer-qib vanadium oxide detector nrog tsawg zog noj.
Lub module yog kev koom ua ke nrog 3.2mm lens thiab shutter, nruab nrog USB interface board, yog li nws tuaj yeem tsim rau hauv cov khoom sib txawv.
Tswj raws tu qauv lossis SDK kuj yog muab rau kev txhim kho theem nrab.
Khoom specification | Tsis muaj | Khoom specification | Tsis muaj |
Hom kev ntes | Vanadium oxide uncooled infrared focal dav hlau | Kev daws teeb meem | 256 * 192 hli |
Spectral ntau yam | 8-14 : kuv | Kev ntsuas qhov kub thiab txias | -15 ℃ -600 ℃ |
Pixel nrug | 12 awm | Kub ntsuas qhov tseeb | ± 2 ℃ lossis ± 2% ntawm kev nyeem ntawv, qhov twg ntau dua |
NETD | ± 50mK @ 25 ℃ | Qhov hluav taws xob | 5V |
Ncej zaus | 25 Hz | Lens parameters | 3.2 hli F / 1.1 |
Kev kho dawb | Txhawb nqa | Ua kom pom tseeb hom | Tsau tsom |
Ua haujlwm kub | -10 ℃ -75 ℃ | Interface board loj | 23.5mm x 15.5 hli |
Qhov hnyav | <10g | Kub calibration | Secondary calibration yog muab |
Interface | USB |
Sau koj cov lus ntawm no thiab xa tuaj rau peb